Murata’s innovative silicon Integrated Passive Devices technology enables silicon passive components to be considered as a superior solution in specific markets where high performance and miniaturization are required.
Formerly IPDiA, the company has been acquired by Murata in October 2016 and became Murata Integrated Passive Solutions in April 2017. Its innovative technology consists in using a semiconductor process to manufacture silicon passive components or arrays. From the very beginning, the company targeted specific areas where high performance and miniaturization are required (for example implantable and wearable medical electronics, high reliability, telecommunications…).
Thanks to its own R&D center and partnerships with well-known European research laboratories, Murata Integrated Passive Solutions has been able to anticipate customers’ needs and has consolidated its position as an innovating company.
Murata Integrated Passive Solutions is located in Caen, France. The site includes a wafer foundry (silicon wafer facility: 10 000 m² / clean room areas: 3000 m²). The manufacturing facility is certified ISO 9001 / 14001 / 18001 as well as ISO TS 16949 for the Automotive market and ISO 13485 for medical devices.
Murata Integrated Passive Solutions is supported in terms of Sales by Murata's worldwide force.
Integrated Passive Devices technology in brief
The unique IPD technology developed by Murata Integrated Passive Solutions is a highly efficient way of integrating tens or even hundreds of passive components in a silicon die. Moreover, the performances resulting from this technology exceed those obtained with traditional SMDs. The size of application boards could easily be reduced by a factor of more than 10 to create unprecedented innovative products. In addition, greater reliability and significant cost reductions can be achieved by replacing external SMD components by customized IPD dies.