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Two Major EU Research Institutes and Three High-tech SMEs Launch Project to Industrialize New World Record High-density Capacitors

2013-12-03

PICS Project Will Develop Innovative Atomic Layer Deposition Materials And Tools for High-Density 3D Integrated Capacitors


CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density.


The two-year EU-funded PICS project is designed to develop a disruptive technology that results in a new world record for integrated capacitor densities (over 500nF/mm2) combined with higher breakdown voltages. It will strengthen the SME partners’ position in several markets, such as automotive, medical and lighting, by offering an even higher integration level and more miniaturization.

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