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2D / 2.5D Interposer Webcast from IPDiA


2D / 2.5D Interposer Webcast from IPDiA

Please find below the presentation of the webcast made the 09th December 2013 by IPDiA:


How far you could stimulate your integration:

From Passive integration to Packaging integration

Increasing System integration While Reducing Power and Size


-  The topic of passive integration on silicon and its intersection with 2D/2.5D interposer platform as a packaging integration and miniaturization breakthrough is presented.

 - An illustration of via-last processing on ASIC or IPD wafers is developed until the end surface preparation for further packaging post-processing.

  - Example of modules developed thanks to integration capability and interposer platform is shown to illustrate its application advantages.