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The R&D program PRIIM launched by IPDiA reaches its end and allows the industrialization of ultra-miniaturized electronic components

2014-03-19

Caen, March 18th 2014 – Four years after the launch of its PRIIM project (platform for the realization of shared industrial innovation), IPDiA presents the major technological results achieved during this program.

 

In January 2010, IPDiA announced the launch of a major R&D program named PRIIM, in collaboration with industrial partners (Movea, Sorin, Gemalto and Kalray) and technological partners (CEA-Leti, CRISMAT(1), 3D Plus and CNRS LAAS). The aim of this program led by IPDiA and supported by Bpifrance was to define new application requirements for high-growth markets such as implantable medical devices (stimulators, defibrillators, motion detectors), multimedia chips and complex embedded systems.