TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions
During the 10th International Conference and Exhibition on Device Packaging in March, the following subject has been addressed: TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions by Catherine Bunel, R&D Director at IPDiA.
TSV is one of the key technologies for 3D integration. TSVs co-integrated with passives including high density capacitors enable highly integrated heterogeneous solutions required because of the smaller size of the electronic modules. Significant progress has already been done on the process, on the testability, on the performances of these smart interposers. The major progress is in the adoption of the technology. In this presentation, we expose some examples where the adoption was driven by cost, performances & miniaturization. Emphasis will be placed on the performances of the new generation of 3D Silicon capacitors, using key enabling technology like ALD and amazing architecture that allow impressive capacitance density increase.