Home >> Our Products >> Baluns / Transformers
Baluns / Transformers
Product Description
IPDiA baluns have been specifically designed for space-constrained and for performances demanding applications in the GSM, DCS, WCDMA, WLAN (WiFi™) and WiMax frequency ranges.
Thanks to IPDiA’s proprietary IPD technology, IPDiA baluns offer a 50% gain in footprint compared to non-silicon solutions
Key Benefits
• Extremely low insertion loss
. 0.5dB (typ) for dual-band WiFi™
. 0.75dB (typ.) for DCS & WiFi™
. 0.95dB (typ.) for GSM & WiMax
• Return loss >12dB
• Smaller than SMDs
• Directly attachable on PCB by wire bonding with Chip On Board (COB) or flipped on PCB by standard reflow assembly
• High Temperature stability
• High reliability
Key Features
• Passive integration on Silicon
• Low insertion loss
• Unbal./bal.impedance : 50Ω/50Ω or 100Ω/50Ω or 200Ω/50Ω
• Frequency range : 824 to 5900MHz
• Operating temperature range : -55 to +150°C
• WLCSP package
.160µm SAC305 bump size
.500µm bump pitch